NUKLEONIKA 2006, 51(Suppl. 1):s83-s88

In response to the problem of environmental protection, the electronic industry is studying the lead-free alloys as substitutes for lead-containing solder alloys. At the same time, with progress in electronic devices in recent years, smaller size and higher precision are strongly demanded in electronic board connections. Therefore, it is necessary to prepare fine powders of solder paste for these connections. To produce such lead-free solder balls, a novel powder-making process, “hybrid atomization” that combines gas atomization and centrifugal atomization, was used. This technique produces very fine and spherical tin alloy powders with a mean diameter of about ten micrometers and very narrow size distribution with few satellites at low production cost. Taking a Sn-9mass%Zn alloy as an example, process experiments were carried out, and the effect of temperature, spray distance and disk rotating speed on the resultant powder properties were examined. The optimal processing conditions were determined from the results; the influences of the processing parameters on the properties of the obtained powders were quite different from those in the conventional atomization processes. The spherical powder with a mean diameter of 10.6 mm and a standard deviation of 1.3 ~ 1.7 was obtained in the determined optimum condition.